These are generic design rules. For TSMC02d, you need to use the rule numbers in the DEEP column and multiply the values by λ=0.09μm. Also, use 5+ Metal process rules.
Vias must be drawn orthogonal to the grid of the layout. Non-Manhattan vias are not allowed.
Rule | Description | Lambda | |||||
---|---|---|---|---|---|---|---|
4 metal Process | 5+ Metal Process | ||||||
SCMOS | SUBM | DEEP | SCMOS | SUBM | DEEP | ||
21.1 | Exact size | 2x2 | 2x2 | n/a | n/a | 2x2 | 3x3 |
21.2 | Minimum spacing | 3 | 3 * | n/a | n/a | 3 | 3 |
21.3 | Minimum overlap by Metal3 | 1 | 1 | n/a | n/a | 1 | 1 |
These are generic design rules. For TSMC02d, you need to use the rule numbers in the DEEP column and multiply the values by λ=0.09μm. Also, use 5+ Metal process rules.
Rule | Description | Lambda | |||||
4 Metal Process | 5+ Metal Process | ||||||
SCMOS | SUBM | DEEP | SCMOS | SUBM | DEEP | ||
22.1 | METAL4 width | 6 | 6 | n/a | n/a | 3 | 3 |
22.2 | METAL4 space | 6 | 6 | n/a | n/a | 3 | 4 |
22.3 | METAL4 overlap of VIA3 | 2 | 2 | n/a | n/a | 1 | 1 |
22.4 | Minimum spacing when either metal line is wider than 10 lambda | 12 | 12 | n/a | n/a | 6 | 8 |