| 1 |
7,760,412 |
 |
Mechanically-active anti-reflection switch (MARS) modulator with wide angle
tolerance |
| 2 |
7,387,451 |
 |
Composites for wireless optical communication |
| 3 |
7,180,652 |
 |
Mars optical modulators |
| 4 |
6,996,151 |
 |
Tin oxide adhesion layer for metal-dielectric mirrors |
| 5 |
6,718,086 |
 |
Article comprising a tunable filter |
| 6 |
6,707,840 |
 |
Vertical cavity surface emitting laser |
| 7 |
6,704,513 |
 |
Enhanced tilt optical power equalizer |
| 8 |
6,643,052 |
 |
Apparatus comprising a micro-mechanical optical modulator |
| 9 |
6,631,246 |
 |
Wavelength division multiplexed optical communication system having tunable
multi-channel dispersion compensating filters |
| 10 |
6,519,073 |
 |
Micromechanical modulator and methods for fabricating the same |
| 11 |
6,501,589 |
 |
Article comprising a metallic anti-mirror |
| 12 |
6,485,996 |
 |
Method of making wafer having top and bottom emitting vertical-cavity
lasers |
| 13 |
6,458,411 |
 |
Method of making a mechanically compliant bump |
| 14 |
6,444,491 |
 |
Composite semiconductor devices and method for manufacture thereof
|
| 15 |
6,434,726 |
 |
System and method of transmission using coplanar bond wires |
| 16 |
6,424,450 |
 |
Optical modulator having low insertion loss and wide bandwidth |
| 17 |
6,388,322 |
 |
Article comprising a mechanically compliant bump |
| 18 |
6,337,753 |
 |
Optical power equalizer |
| 19 |
6,321,010 |
 |
Optical microstructure and method of manufacture |
| 20 |
6,307,983 |
 |
Robotic optical cross-connect |
| 21 |
6,307,691 |
 |
Optical filter and method for linearization of optical power equalizer
|
| 22 |
6,277,668 |
 |
Optical detector for minimizing optical crosstalk |
| 23 |
6,271,943 |
 |
Wavelength demultiplexing stack photodiode detector with electrical
isolation layers |
| 24 |
6,258,616 |
 |
Method of making a semiconductor device having a non-alloyed ohmic contact
to a buried doped layer |
| 25 |
6,222,206 |
 |
Wafer having top and bottom emitting vertical-cavity lasers |
| 26 |
6,172,417 |
 |
Integrated semiconductor devices |
| 27 |
6,169,833 |
 |
CMOS-compatible optical bench |
| 28 |
6,159,760 |
 |
Method of fabricating oxide-aperture vertical cavity surface emitting
lasers |
| 29 |
6,048,751 |
 |
Process for manufacture of composite semiconductor devices |
| 30 |
6,034,431 |
 |
Electronic integrated circuit with optical inputs and outputs |
| 31 |
6,005,262 |
 |
Flip-chip bonded VCSEL CMOS circuit with silicon monitor detector |
| 32 |
6,002,513 |
 |
Optical modulator providing independent control of attenuation and spectral
tilt |
| 33 |
5,996,221 |
 |
Method for thermocompression bonding structures |
| 34 |
5,977,571 |
 |
Low loss connecting arrangement for photodiodes |
| 35 |
5,975,408 |
 |
Solder bonding of electrical components |
| 36 |
5,962,846 |
 |
Redundant linear detection arrays |
| 37 |
5,949,571 |
 |
Mars optical modulators |
| 38 |
5,949,561 |
 |
Wavelength demultiplexing multiple quantum well photodetector |
| 39 |
5,943,158 |
 |
Micro-mechanical, anti-reflection, switched optical modulator array and
fabrication method |
| 40 |
5,943,155 |
 |
Mars optical modulators |
| 41 |
5,940,723 |
 |
Heteroepitaxial growth of III-V materials |
| 42 |
5,923,951 |
 |
Method of making a flip-chip bonded GaAs-based opto-electronic device
|
| 43 |
5,918,794 |
 |
Solder bonding of dense arrays of microminiature contact pads |
| 44 |
5,914,804 |
 |
Double-cavity micromechanical optical modulator with plural multilayer
mirrors |
| 45 |
5,900,983 |
 |
Level-setting optical attenuator |
| 46 |
5,897,333 |
 |
Method for forming integrated composite semiconductor devices |
| 47 |
5,872,016 |
 |
Process of making an optoelectronic devices utilizing multiple quantum well
pin structures |
| 48 |
5,870,221 |
 |
Micromechanical modulator having enhanced performance |
| 49 |
5,858,814 |
 |
Hybrid chip and method therefor |
| 50 |
5,838,484 |
 |
Micromechanical optical modulator with linear operating characteristic
|